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• |
Design, develop and manufacture of machines
to be used mainly in the semiconductor back-end
assembly process. |
Some of the machines designed and manufactured
by our Equipment Department are as follows: |
| |
(i) |
Auto Frame Loader
This machine automatically takes the fragile
wire bonded lead-frames from magazines and
places them onto a loading frame using a “Scara”
type robotic arm. |
| |
(ii) |
Dry Auto-Buffing Machine
This is used to remove excess mold resin bleed
and tape residue from the sensitive surface
of leadless package lead-frames. |
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(iii) |
Strip Laser Marking System
Machines that automate the process of laser
marking of IC packages. |
| |
(iv) |
High Speed Servo Trim and Form System
This machine automatically delivers individual
lead-frames with encapsulated IC chips into
a die-set for trimming and forming of the
leads into required shapes for use in PCBAs. |
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• |
Our Precision Tooling Department (PTD) designs,
develops, fabricates and installs precision
tools for precision application to the accuracy
of two microns, as currently required in the
semiconductor industry. |
The products manufactured by our PTD can be
classified into two major categories: |
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• |
Encapsulation Molds
Our PTD manufactures a variety of ferrous
encapsulation molds, which are used by our
customers, in conventional molding as well
as automold machines, to form the protective
encapsulation of an IC chip. Encapsulation
molds are designed and manufactured by us
according to our customers’ requirements
and specifications. |
| |
• |
Trim and Form Dies
Our PTD also manufactures a variety of ferrous
dies used in trimming and forming machines
for the purposes of trimming and forming of
encapsulated IC chips by cutting and bending
the terminals of the lead-frame to different
shapes prior to their assembly onto the printed
PCB. |
